Foxconn’s high-end test project settled in Qingdao and plans for production next year

On April 15, Qingdao West Coast New Area signed a cloud contract with Foxconn Technology Group through online video, marking the launch of the high-end test project.

On April 15, Qingdao West Coast New Area signed a cloud contract with Foxconn Technology Group through online video, marking the launch of the high-end test project.

The project will expand the integrated circuit industry chain in Qingdao West Coast New Area, promote the transformation and upgrading of integrated circuit industry in the new area and even Qingdao, and promote high-quality economic and social development.

The semiconductor high-end test project of Foxconn, jointly invested by Foxconn Technology Group and Rongkong Group, will use the world’s leading high-end packaging technology to seal the 5G communications, artificial intelligence and other application chips that are in rapidly-growing demand.

The construction of the project is scheduled to start this year, and is expected to start production in 2021 and reach production goals in 2025.

It is said that Qingdao is at the forefront of China’s new round of high-level opening up to the outside world, leveraging new technologies, new models, and new business types spawned by the New Infrastructure, to empower a wide range of industries, aiming to build the industrial internet capital of the world.

Disclaimer: This is an article created by Michael Liang for Chinasdg.org. You can find the original article here: https://chinasdg.org/2020/04/17/foxconns-high-end-test-project-settled-in-qingdao-and-plans-for-production-next-year/.

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