China Greatwall Technology launches first domestic semiconductor laser stealth wafer dicer

China Greatwall Technology Group said that China’s first semiconductor laser stealth wafer cutting machine has been successfully developed by the company recently, which fills the domestic gap and leads the international market in key performance parameters.

China Greatwall Technology Group said that China’s first semiconductor laser stealth wafer cutting machine has been successfully developed by the company recently, which fills the domestic gap and leads the international market in key performance parameters.

This means that China’s semiconductor laser stealth wafer cutting technology has made a substantial and major breakthrough, and the dependence of related equipment on imports will be a history.

Wafer cutting is an indispensable key process in the semiconductor packaging and testing process.

Liu Zhenyu, vice president of China Greatwall Technology Group and president of Zhengzhou Rail Transit Design and Research Institute, said that compared with traditional cutting methods, laser cutting is a non-contact process that can avoid damage to the surface of crystalline silicon.

And this technology has the characteristics of high processing accuracy and high processing efficiency, which can greatly improve the quality, efficiency and benefit of chip manufacturing.

Disclaimer: This is an article created by Michael Liang for Chinasdg.org. You can find the original article here: https://chinasdg.org/2020/05/19/china-greatwall-technology-launches-first-domestic-semiconductor-laser-stealth-wafer-dicer/.

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