Shenzhen Lingsi Microelectronics closes multi-million-yuan Pre-A financing round

Shenzhen Lingsi Microelectronics has recently completed its Pre-A financing round, raising tens of millions of yuan from Vertex Ventures. The company’s CEO Huang Hai revealed that proceeds from this round of financing will mainly be used for product development, team building and business development.

Shenzhen Lingsi Microelectronics has recently completed its Pre-A financing round, raising tens of millions of yuan from Vertex Ventures. The company’s CEO Huang Hai revealed that proceeds from this round of financing will mainly be used for product development, team building and business development.

Established in June 2018, Shenzhen Lingsi Microelectronics focuses on research and development of high-performance analog-to-digital converters (ADCs), and has three core innovative technologies including ADC architecture, calibration algorithms, and circuit modules.

The technology developed by Lingsi has increased the conversion speed to 1GS / s without sacrificing the power consumption of traditional low-power ADCs, and has been successfully applied to the scenarios of LIDAR, oscilloscope and 5G communication.

Two years after its inception, the 1GS / s 8bit high-speed ADC product developed by the company has won orders worth one million yuan from LIDAR clients.

On the team side, CEO Huang Hai, who graduated from the University of Texas, has successfully developed four ADC chips and published several high-quality papers in the world’s top chip conference journals ISSCC and JSSC.

Chief scientist Li Qiang is a professor at the University of Electronic Science and Technology of China, focusing on ADC research; CTO Zhang Lijun has nearly 10 years of experience in ADC chip development.

Disclaimer: This is an article created by Michael Liang for Chinasdg.org. You can find the original article here: https://chinasdg.org/2020/05/29/shenzhen-lingsi-microelectronics-closes-multi-million-yuan-pre-a-financing-round/.

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