China’s first domestically-made NAND chip will be available in 2020: YMTC

On the 30th, China’s first domestic NAND chip will be launched in the second half of 2020, said Cheng Weihua, CTO of Yangtze Memory Technology Corp (YMTC), at SEMICON China 2020.

On the 30th, China’s first domestic NAND chip will be launched in the second half of 2020, said Cheng Weihua, CTO of Yangtze Memory Technology Corp (YMTC), at SEMICON China 2020.

YMTC mainly supplies NAND Flash. In April this year, YMTC announced that it has successfully developed a 128-layer 3D NAND.

Last September, YMTC’s 64-layer TLC flash memory based on Xtacking technology started mass production.

Its scheme of using YMTC 64-layer TLC products will be launched in the second half of the year, including SATA SSD, PCIe SSD, eMMC, UFS and other products.

It is currently working with Goke Microelectronics, Longsys, ADATA Technology, Phison Electronics, Maxio Technology, and Silicon Motion and other high-quality partners to jointly promote the application of the 64-layer TLC products.

Last week, YMTC invested USD 24 billion in a 300,000-mu plant in Wuhan, and plans to meet 23% of the global market demand.

By the end of 2021, the estimated capacity of YMTC will reach 80,000 wpm.

Disclaimer: This is an article created by Michael Liang for Chinasdg.org. You can find the original article here: https://chinasdg.org/2020/06/30/china-s-first-domestically-made-nand-chip-will-be-available-in-2020-ymtc/.

Leave a Reply

Please Login to Comment